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Larrabee Details Surface at IDF Beijing 2009
Intel has recently revealed more details on its Larrabee project, which will indeed see Intel entering the discrete graphics market, at IDF Beijing 2009.
In February Intel reformated the IDF (Intel Developer Forum) Beijing 2009 from two days into a one-day event as part of its ongoing cost reduction efforts amid the global slowdown.
Pat Gelsinger, senior vice president and general manager of the Digital Enterprise Group at Intel says that the die area of Larrabee will be even larger than NVIDIA 65nm GT200, reaching 600mm2.
Gelsinger also indicates that Larrabee is designed on the basis of X86 architecture and added with tons of SIMD and texture units. Each chip will include 512bit vector processing units. The first Larrabee-powered graphics card will be launched late 2009 or at the beginning of next year. However, Gelsinger doesn’t disclose the manufacturing process that Larrabee employs, and it’s very likely to be 45nm.
[See links for images]
http://en.expreview.com/img/2009/04/11/larrabee1.jpg
Source: expreview.com
In February Intel reformated the IDF (Intel Developer Forum) Beijing 2009 from two days into a one-day event as part of its ongoing cost reduction efforts amid the global slowdown.
Pat Gelsinger, senior vice president and general manager of the Digital Enterprise Group at Intel says that the die area of Larrabee will be even larger than NVIDIA 65nm GT200, reaching 600mm2.
Gelsinger also indicates that Larrabee is designed on the basis of X86 architecture and added with tons of SIMD and texture units. Each chip will include 512bit vector processing units. The first Larrabee-powered graphics card will be launched late 2009 or at the beginning of next year. However, Gelsinger doesn’t disclose the manufacturing process that Larrabee employs, and it’s very likely to be 45nm.
[See links for images]
http://en.expreview.com/img/2009/04/11/larrabee1.jpg
Source: expreview.com
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